Components of the Centrino platform. From right, clockwise: Intel PRO/Wireless network adapter, Intel mobile processor, Intel mobile chipset ( southbridge and northbridge).
Centrino, a platform-marketing initiative from Intel, covers a particular combination of CPU (mainly pentium M), mainboard chipset and wireless network interface in the design of a laptop personal computer.
|
Contents
- 1 Successive implementations
- 1.1 Carmel platform
- 1.2 Sonoma platform
- 1.3 Napa platform
- 1.4 Santa Rosa platform
- 2 Marketing
- 3 See also
- 4 External links
|
Successive implementations
Carmel platform
Intel used Carmel as the code name for the first-generation Centrino platform launched in March 2003.
The Carmel platform consists of:
- an Intel Pentium M processor (code named Banias or later Dothan) with a 400 MT/s FSB,
- an Intel 855 series chipset (code named Odem or Montara), and
- an Intel PRO/Wireless 2100 or later 2200 (IEEE 802.11b) mini-PCI WiFi adapter (code named Calexico or Calexico2).
Industry-watchers initially criticized the Carmel platform for its lack of an IEEE 802.11g-solution, because many independent WiFi chip-makers like Broadcom and Atheros had already started shipping 802.11g products. Intel responded that the IEEE had not finalized the 802.11g standard at the time of Carmel's launch, and that it did not want to launch products not based on a finalized standard.
In early 2004, after the finalization of the 802.11g standard, Intel permitted an Intel PRO/Wireless 2200BG (code named Calexico2) to substitute for the 2100. At the same time, they permitted the new Dothan Pentium M to substitute for the Banias Pentium M.
Initially, Intel permitted only the 855GM chipset, which did not support external graphics. Later, Intel allowed the 855GME and 855PM chips, which did support external graphics, in Centrino notebooks.
Despite criticisms, the Carmel platform won quick acceptance among OEMs and consumers. Carmel could attain or exceed the performance of older Pentium 4-M platforms, while allowing for notebooks to operate for 4 to 5 hours on a 48 W-h battery. Carmel also allowed notebook-manufacturers to create thinner and lighter notebooks because its components did not dissipate much heat, and thus did not require large cooling systems.
Sonoma platform
Intel used Sonoma as the code name for the second-generation Centrino platform, launched in January 2005.
The Sonoma platform consists of:
- an Intel Pentium M processor (code-named Dothan) with a 533 MT/s FSB,
- an Intel Mobile 915 Express series chipset (code-named Alviso), and
- the Intel PRO/Wireless 2200 or 2915ABG mini-PCI WiFi adapter (code-named Calexico2).
The Mobile 915 Express chipset, like its desktop version, supports many new features such as DDR2, PCI Express, Intel High Definition Audio, and SATA. Unfortunately, the introduction of PCI Express and faster Pentium M processors causes notebooks built around the Sonoma platform to have a shorter battery-life than their Carmel counterparts; Sonoma notebooks typically achieve between 3.5-4.5 hours of battery-life on a 53 W-h battery.
Napa platform
|
|
Napa-era Centrino Duo logo
|
The code-name Napa designates the third-generation Centrino platform, introduced in January 2006 at the Winter Consumer Electronics Show.
The platform consists of:
- an Intel Core (code-named Yonah) or Core 2 processor (code-named Merom)
- an Intel Mobile 945 Express-series chipset (code-named Calistoga), and
- the Intel PRO/Wireless 3945ABG mini-PCIe WiFi adapter (code-named Golan).
Intel uses Centrino Duo branding for laptops with dual-core ("Core Duo") processors and retains the Centrino name for laptops with single core ("Core Solo") processors.
Santa Rosa platform
The code-name Santa Rosa refers to the fourth-generation Centrino platform, scheduled for release in April 2007 with the following features:[1]
- second generation Intel Core 2 processor (code named Merom) that uses Socket P
- 800 MT/s front side bus with Dynamic Front Side Bus Switching to save power during low utilization
- Intel Mobile 965 Express chipset (code named Crestline) with Intel's GMA X3000 graphics technology
- Intel PRO/Wireless 4965AGN IEEE 802.11 a/b/g/n mini-PCIe WiFi adapter (code named Kedron)
- NAND flash-memory caching (code-named Robson)
- WWAN Internet access via cellular networks (code-named Windigo)
- EFI, a successor to BIOS
- Integrated HSDPA (3.5G) wireless technology from Nokia [1]
Marketing
Intel has reportedly invested US$300 million in Centrino advertising. Because of the ubiquity of the marketing campaign, many consumers mistakenly refer to Pentium M and Intel Core processors as "Centrinos". Many consumers have received the impression that only Centrino provides wireless connectivity in a notebook. This has resulted in increased demand for Intel's PRO/Wireless chipsets.
The Centrino marketing program has been widely assumed to be responsible for the success of Intel notebook PCs. However, findings of the Japanese FTC in March of 2005indicate that the financial incentives associated with the Centrino program were used as illegal, anti-competitive practices by Intel to induce its customers not to buy notebook chips from Intel's long time rival AMD. In the quarter immediately following the JFTC ruling, AMD boasted more than 60 notebook computer design wins which was a strong resurgence from the drastic share reductions seen in 2003 and 2004.
See also
External links
- Information from Intel Corporation.
- Intel Processor comparison table
- Lindows CEO attacks Intel's Centrino Linux lockout, March 20, 2003.
- Intel's Centrino operating system support page.
- Linux on Centrino based laptops and notebooks.
- Homepage of the software "Notebook Hardware Control"
- Something like "Notebook Hardware Control" for Linux
- Mandriva as the first officially-supported Linux distribution on Intel Centrino mobile technology (Friday October 14 2005)
Categories: Laptops | IBM PC compatibles | Intel
